Microscope image of electromigration-induced hillock and void

Thermal Stress Characteristics and Stress-Induced Void Formation in Aluminum and Copper Interconnects (Chapter 3) - Electromigration in Metals

Electromigration (all content)

Thermal Stress Characteristics and Stress-Induced Void Formation in Aluminum and Copper Interconnects (Chapter 3) - Electromigration in Metals

PDF] Hillock formation during electromigration in Cu and Al thin films: Three‐dimensional grain growth

New Insights into Dewetting of Cu Thin Films Deposited on Si

Electromigration - an overview

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PDF] Electromigration in bamboo aluminum interconnects

In-Situ Observation and Quantitative Analysis of Electromigration Void Dynamics

Hillock and void formations in wires due to electromigration (Photo

Electromigration Reliability of Barrierless Ruthenium and Molybdenum for Sub-10 nm Interconnection

Materials, Free Full-Text

Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods